To have appropriate heating temperature, so that the solder material has a certain fluidity, can achieve the purpose of welding, but the temperature can not be too high, too high is easy to form oxide film and affect the welding quality.
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I played once in three days and 4 times in half a month. Later, I could not help feeling "this is what the development board should have looked like".
The molten solder diffuses along the surface of the welds with the help of capillary suction, forming the infiltration of solder and welds, firmly bonding the components and the printing board, and has good electrical conductivity.
The quality of the coating is directly affected by the additive impurities and the foreign impurities brought by the electroplating process.
The molten solder diffuses along the surface of the welds with the help of capillary suction, forming the infiltration of solder and welds, firmly bonding the components and the printing board, and has good electrical conductivity.
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At present, there are too many circuit board factories and they are very miscellaneous. Electronic manufacturers to choose a wide range, and it is difficult to choose the right manufacturers.
Usually, the power consumption and heat dissipation of high-speed circuits are also large, so sufficient attention should be paid to the high-speed PCB.
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For integrated circuits, due to the increase in edge speed, if no other measures, the length of the line is greatly shortened to maintain the integrity of the signal.
Transmission delays on ground and interconnect lines in high-speed systems are also factors to be considered in system design.
