Hole without copper open circuit
Different resin systems and substrate materials are used, and different resin systems will lead to significant differences in the activation effect of copper sinking treatment and copper sinking treatment.
Контрактное производство электроники под ключ в Китае
Шэньчжэнь, район Баоань, улица Фуюн, улица Фуцяо, район 3, промышленный парк Лонгхуй 6
The possible reason is that the pressure of the fan nozzle is large.
Reducing line width and line spacing is to maximize the use of limited area, and increasing the number of layers is to use space. The circuit mainstream of future circuit boards will be 2 to 3mil, or smaller.
PCB circuit board design and wiring principles
How to improve SMT SMT processing efficiency: first, advance work preparation, second, ensure the SMT SMT machine running time balance, third, equipment operating parameters
PCB board debugging technology of six types of modules
The trial-production process of six types of modules generally carried out by domestic counterparts is mainly after determining the main circuit, designing the compensation circuit, carrying out a large number of scheme design and sample production.
PCB industry: 5G commercial landing to promote the high growth of PCB demand in the future focus on high-level HDI and packaging substrate
the growth rate is the passive components and PCB as the representative of the component plate. 5G substrates, such as soft boards, high-end high-speed materials and PCB, are comprehensively distributed, benefiting from the strong flexibility of 5G and th
Wiring arrangement and reasonable layout of components on PCB board
Vertical refers to the component body perpendicular to the circuit board installation, welding, its advantage is to save space, horizontal refers to the component body parallel and close to the circuit board installation, welding, its advantage is that th
Thermal analysis
linear expansion coefficient and glass transition temperature. The PCB of substrate with excessive expansion coefficient often leads to the fracture failure of metallization hole after welding and assembly.
Optimization in PCB production engineering
In addition to the production process, the storage of PCB board parts at each station also has a certain impact on the deformation. In some manufacturers, due to more production waiting and narrow site, multiple boards will be stacked together for storage
Discussion on the cause of bubbling on the surface of copper plating circuit board
Based on years of actual production experience and service experience, Now on the circuit board of copper plating surface foaming causes do a brief analysis, hope to help the industry peers!
Installation of capacitance
The signal line of low power should not be directly paved, and the welding plate must be directly paved through the high current. Whether it's a right Angle or a 45 degree Angle is beautiful.
Analysis of main characteristics and cost of flexible circuit board
The insulating substrate may be polyimide, polyethylene terephthalate, arylamide fiber ester and polyvinyl chloride.
Common methods are
Polyester, glass fiber, polymer material, aluminum sheet, steel sheet, etc. Reasonable design of the position, area and material of the reinforced plate has great effect on avoiding FPC tearing.
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