Контрактное производство электроники под ключ в Китае
Odd layer PCB needs to add non - standard laminated core layer bonding technology on the basis of nuclear structure technology. Compared with the nuclear structure, the production efficiency of the plant adding foil outside the nuclear structure will decr
Opening, drying board, mechanical drilling blind buried hole, copper sinking, full plate plating, inner graphics, plating holes, inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling, removing glue, drilling, normal process
drying board, mechanical drilling for buried holes, copper sinking, full plate plating (negative film process, plating to the required copper thickness), inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling edge, drilling (L2
The above is the overview of optical module PCB and optical device simulation. There are not many things to simulate, but there are also many places to be carefully handled.
The above is the knowledge that optical module PCB and optical device cascade simulation need to master. Compared with chip packaging and board level PCB, there are a lot less things, and because there are a lot of repetitive things in optical module simu
The high yield, low cost shear method is the use of hydraulic punch and steel die. Although costly steel molds are required, this method can cut out many flexible circuit boards at the same time.
Therefore, the most important performance of PCB substrate materials used in 5G communication is to meet the requirements of high frequency and high speed, as well as integration, miniaturization, lightweight, multi-function and high reliability.
The bending radius of flexible PCB is a key index to understand the design capability and the manufacturing process of flexible PCB. Different flexible circuit boards use different layers, which affect the bending radius of flexible PCB. You can learn how
When proprietary liquid resist is used in conjunction with CL coater, the intent is to save PCB manufacturers significant time and money, as well as improve the quality of the final product and reduce defects.
In some cases, the layout and safety considerations involved in high-current board design are similar to those in high-voltage design, especially when we consider safety.
In the previous article, we discussed the proper layout of instrument amplifier (OP-amp) PCBS and provided a series of good layout practices for reference. Next, we'll explore common mistakes when arranging instrumentation amplifiers (INA), and then show
EOS failure (left) compared to ESD failure of a single transistor (right). Note that ESD failure can cause a short circuit between the collector and emitter region.