Контрактное производство электроники под ключ в Китае
Производство печатных плат

Производство печатных плат

PCB board has double-sided PCB
11May
Kim 0 Замечания

PCB board has double-sided PCB

Odd layer PCB needs to add non - standard laminated core layer bonding technology on the basis of nuclear structure technology. Compared with the nuclear structure, the production efficiency of the plant adding foil outside the nuclear structure will decr

8-layer mechanical blind hole plate (4+4 mechanical blind hole structure)
11May
Kim 0 Замечания

8-layer mechanical blind hole plate (4+4 mechanical blind hole structure)

Opening, drying board, mechanical drilling blind buried hole, copper sinking, full plate plating, inner graphics, plating holes, inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling, removing glue, drilling, normal process

How to distinguish HDI PCB first and second and third order
11May
Kim 0 Замечания

How to distinguish HDI PCB first and second and third order

drying board, mechanical drilling for buried holes, copper sinking, full plate plating (negative film process, plating to the required copper thickness), inner graphics, inner etching, inner AOI, brown, laminating, drying board, milling edge, drilling (L2

The main circuit of PCB circuit board is copper foil
11May
Kim 0 Замечания

The main circuit of PCB circuit board is copper foil

The above is the overview of optical module PCB and optical device simulation. There are not many things to simulate, but there are also many places to be carefully handled.

Saifu circuit specializing in the production of PCB multilayer board
11May
Kim 0 Замечания

Saifu circuit specializing in the production of PCB multilayer board

The above is the knowledge that optical module PCB and optical device cascade simulation need to master. Compared with chip packaging and board level PCB, there are a lot less things, and because there are a lot of repetitive things in optical module simu

Manufacturing procedure of flexible plate
11May
Kim 0 Замечания

Manufacturing procedure of flexible plate

The high yield, low cost shear method is the use of hydraulic punch and steel die. Although costly steel molds are required, this method can cut out many flexible circuit boards at the same time.

High speed material properties
11May
Kim 0 Замечания

High speed material properties

Therefore, the most important performance of PCB substrate materials used in 5G communication is to meet the requirements of high frequency and high speed, as well as integration, miniaturization, lightweight, multi-function and high reliability.

What is Flex PCB bend Radius?
11May
Kim 0 Замечания

What is Flex PCB bend Radius?

The bending radius of flexible PCB is a key index to understand the design capability and the manufacturing process of flexible PCB. Different flexible circuit boards use different layers, which affect the bending radius of flexible PCB. You can learn how

INA universal PCB layout
10May
Kim 0 Замечания

INA universal PCB layout

When proprietary liquid resist is used in conjunction with CL coater, the intent is to save PCB manufacturers significant time and money, as well as improve the quality of the final product and reduce defects.

Introduction to high current circuit board design
09May
Kim 0 Замечания

Introduction to high current circuit board design

In some cases, the layout and safety considerations involved in high-current board design are similar to those in high-voltage design, especially when we consider safety.

The first layout attempt
09May
Kim 0 Замечания

The first layout attempt

In the previous article, we discussed the proper layout of instrument amplifier (OP-amp) PCBS and provided a series of good layout practices for reference. Next, we'll explore common mistakes when arranging instrumentation amplifiers (INA), and then show

Fundamentals of electrical pressure testing
09May
Kim 0 Замечания

Fundamentals of electrical pressure testing

EOS failure (left) compared to ESD failure of a single transistor (right). Note that ESD failure can cause a short circuit between the collector and emitter region.

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