Circuit board processing circle should be how to plate
In addition, this capacitor should be purchased with a relatively large volume, and those with a small volume should also be marked 50V4700uF as far as possible.
Контрактное производство электроники под ключ в Китае
Шэньчжэнь, район Баоань, улица Фуюн, улица Фуцяо, район 3, промышленный парк Лонгхуй 6
pcb self - recovery fuse selection points
Another class of clamp type overvoltage devices are clamp type overvoltage devices with transient suppression diode, varistor, patch varistor and ESD discharge diode.
Circuit board processing several times pressing
Single chip emulator is a set of hardware device specially designed and manufactured for the purpose of debugging single chip software.
PCB processing smt flow chart
In the era of industrialization surplus, circuit board manufacturers in particular, choose a suitable circuit board manufacturers is very important!
Fast identification of PCB green product identification
The understanding of restricted use of metals and substances is based on the analysis of their potential harm to human body.
Exploration on Industrial PCBA Assembly Process of R&D Enterprises (I)
Laser marking technology, as a modern precision machining method, has unparalleled advantages compared with traditional machining methods such as machine labeling, manual labeling, inkjet coding and printing.
Pcb furnace temperature curve test
the industry of hot air reflow welding technology generally relies on two technologies: furnace temperature tester and real-time monitoring system.
What is the meaning of PCBA OEM?
Take a look at the PCBA OEM classification: 1. Technology-oriented, 2. Processing-oriented
How to choose patch inductor for PCBA foundry and material?
Precautions for the use of moisture sensitive devices in PCBA processing:1. Ovens used for baking are required to be ventilated and able to operate under the condition of humidity less than 5%. 2. SMT components shipped in high-temperature carriers can be
SMT patch production process
SMT basic process elements include: screen printing, mounting (curing), reflow soldering, cleaning, testing, repair
MCP POP with SIP package
Factors affecting the quality of BGA patch assembly: 1. Feasibility of BGA pad design, 2. The through hole is distributed externally to the BGA pad. 3. The through hole of the pad has developed with the development of microporous technology in PCB manufac
Why should PCB board be cleaned after processing? What does it do?
No cleaning means that the residues of PCB circuit boards are safe from the chemical point of view, will not have any impact on the production line of PCB circuit boards, and can be left on PCB circuit boards
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