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What are the characteristics of PCB circuit boards that are widely used?
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What are the characteristics of PCB circuit boards that are widely used?

The design of PCB circuit board mainly refers to the layout design, which requires the layout of internal electronic components, metal wires, through holes and external connections, electromagnetic protection, heat dissipation, crosstalk and other factors. Excellent circuit design can save production cost and achieve good circuit performance and heat dissipation performance. PCB board is the electrical connection provider of electronic components. It has a history of more than 100 years.


What are the characteristics of PCB circuit boards that are widely used? Small compilation lists the following points for you:

High reliability: Through a series of inspection, test and aging test, can ensure the PCB circuit board long-term and reliable work. High density: For decades, the high density of printed boards can be developed with the integration of integrated circuits and the advancement of installation technology. Producability: Using modern management, can be standardized, scale (quantity), automation and other production, to ensure the consistency of product quality.

Testability: a relatively complete test method, test standards, various test equipment and instruments have been established to test and identify the qualification and service life of PCB products. Designability: The PCB circuit board performance (electrical, physical, chemical, mechanical, etc.) requirements, can be standardized by design, standardization, etc., to achieve printed board design, short time, high efficiency.

Assemblability: PCB products not only facilitate standardized assembly of various components, but also can be automated and large-scale batch production. At the same time, PCB and various component assembly parts can also be assembled into larger parts, systems, until the whole machine.

Maintainability: Since PCB board products and various component assemblies are standardized in design and scale production, these components are standardized. So, once the system failure, can be quickly, convenient, flexible replacement, quickly restore the system work.

How to make a good PCB board?

We all know that making PCB board is to turn the designed schematic into a real PCB board. Please don't underestimate this process. There are many things that are feasible in principle but difficult to achieve in engineering, or others can achieve things that others can not achieve, so it is not difficult to make a PCB board. But to do a good PCB board is not an easy thing.

The two major difficulties in the field of microelectronics are the processing of high-frequency signals and weak signals, in this respect PCB production level is particularly important, the same principle design, the same components, different people produced PCB will have different results, so how to make a good PCB board

A, to clear the design objectives to accept a design task, first of all to clear its design objectives, is the ordinary PCB board high frequency PCB board small signal processing PCB board or both high frequency and small signal processing PCB board if it is an ordinary PCB board, as long as the layout and wiring is reasonable and neat, accurate mechanical size can be. If there is a load line and long line, it is necessary to use certain means for processing, reduce the load, long line to strengthen the drive, the focus is to prevent long line reflection when there is more than 40MHz signal line on the board to these signal lines for special consideration such as line crosstalk and other problems if the frequency is higher on the length of the wiring there are more strict restrictions

 We know that some special components have special requirements for layout and wiring, such as the analog signal amplifier used in LOTI and APH. The analog signal amplifier requires a stable power supply with small ripple and the analog small signal part should be far away from the power device as far as possible. The small signal amplifier part on the OTI board is also specially equipped with a shield Diffuse electromagnetic interference to shield the GLINK chip used on the NTOI board is ECL process power consumption is large heat dissipation problem must be in the layout must be special consideration if the use of natural heat dissipation. Keyou Circuit is specialized in the production of high-precision multi-layer PCB circuit boards (single panel, double panel, multi-layer board),LED aluminum substrate, copper substrate,3K full/half carbon fiber board, etc. It is a high-tech enterprise with quality assurance, timely delivery and sales as one. It is a manufacturer worthy of reliance.

Iii. Layout of components Consider the layout of components One of the first factors to consider is the electrical performance of the wire closely related components as far as possible together especially for some high-speed line layout to make it as far as possible short power signals and small signal devices to separate in the premise of meeting the circuit performance but also consider the components placed neatly beautiful and easy to test the mechanical size of the socket location also need to seriously consider the grounding in the high-speed system And interconnect latency is also one of the first things to consider in system design. Transmission time on signal lines has a significant impact on the overall system speed, especially for high speed ECL circuits. Although the IC blocks themselves are very fast, However, the system speed can be greatly reduced because of the increase of delay time caused by the delay of 2ns per 30cm line length of the common interconnect on the baseboard. Image shift register synchronization counter.

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