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Инженерная технология

Инженерная технология

How to solve EMI problem in multi-layer PCB design
12Apr
Kim 0 Замечания

How to solve EMI problem in multi-layer PCB design

Starting from the most basic PCB board, this paper discusses the function and design skills of PCB stacking in controlling EMI radiation.

High reliability PCB's 14 important characteristics
12Apr
Kim 0 Замечания

High reliability PCB's 14 important characteristics

All of these problems can cause the solder shield to detach from the circuit board and eventually lead to corrosion of the copper circuit.

Why PCB designs generally control 50 ohm impedance?
12Apr
Kim 0 Замечания

Why PCB designs generally control 50 ohm impedance?

In terms of PCB design, 50 ohm is also selected after comprehensive consideration. In terms of PCB wiring performance, generally low impedance is better.

The PCB routing density is increasing, so the PCB routing design is particularly important.
12Apr
Kim 0 Замечания

The PCB routing density is increasing, so the PCB routing design is particularly important.

With the development of large-scale integrated circuit and super-large scale integrated circuit, the multilayer printed board (PCB) will be used more and more.

Design of PCB anti-jamming technology
12Apr
Kim 0 Замечания

Design of PCB anti-jamming technology

The circuit working at high frequency should consider the interference between components. The general circuit should make parallel arrangement of components as far as possible to facilitate wiring;

Cooling tips for PCB circuit boards
12Apr
Kim 0 Замечания

Cooling tips for PCB circuit boards

To evaluate the heat dissipation capacity of PCB, it is necessary to calculate the equivalent thermal conductivity (9EQ) of the insulating substrate for PCB, which is composed of various materials with different thermal conductivity.

Understand the difference and function of PCB welding aid layer and welding resistance layer
03Apr
Kim 0 Замечания

Understand the difference and function of PCB welding aid layer and welding resistance layer

In the process of PCB high-speed signal circuit design and wiring, engineers need to shorten the lead between the pins of high-speed circuit devices as much as possible.

Rf/microwave design considerations
03Apr
Kim 0 Замечания

Rf/microwave design considerations

The microstrip line consists of a fixed length of metal or wire and the whole or part of the ground plane located directly below it.

Manufacturing problem
03Apr
Kim 0 Замечания

Manufacturing problem

This means that the board's thermal expansion and contraction can be maintained at a stable limit at higher frequencies and temperatures when the PCB goes through cold, hot and very hot reflow cycles compared to FR4.

Controlled impedance circuit board design and interconnector characteristic impedance
03Apr
Kim 0 Замечания

Controlled impedance circuit board design and interconnector characteristic impedance

Even many electronic design engineers are confused. This material will provide a brief and intuitive introduction to characteristic impedance, hoping to help you understand the rather basic qualities of transmission lines.

Eight kinds of PCB surface treatment technology
03Apr
Kim 0 Замечания

Eight kinds of PCB surface treatment technology

the environmental problems involved in PCB production are particularly prominent. The topic of lead and bromine is the hottest, lead-free and halogen-free will affect the development of PCB in many ways.

How to avoid PCB Electromagnetic Interference in Switching Power Supply Design
02Apr
Kim 0 Замечания

How to avoid PCB Electromagnetic Interference in Switching Power Supply Design

Take the core component of each functional circuit as the center, and carry out the layout around it. The components should be arranged evenly, neatly and compact on the PCB, and the leads and connections between the components should be reduced and short

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