Check the buffering action of the suction nozzle fixture of the parts of the patch machine on time. If the buffering action is not smooth, it is recommended to apply a thin layer of lubricant. If the fixture is loose, tighten the moving lens to clean the
What are the characteristics of PCBA assembly plants? First, design ability of PCBA assembly plant; second, quality control of PCBA assembly plant; third, technical support of PCBA assembly plant
These technical challenges require domestic PCB enterprises to grasp the trend of technology and market at all times and take the road of differentiation in order to build unique competitiveness
With the rapid development of the electronic information industry, PCB industry continues to grow. The global output of PCB increased from more than $40 billion in 2008 to $60 billion in 2018. The share of China's PCB industry in the world has also change
Place some grounded holes near the holes of the signal changing layer in order to provide the nearest loop for the signal.
PCBA proofing knowledge: 1.PCBA component installation, 2.PCBA testing, 3.PCBA assembly, 4.PCBA audit
In PCB board backwelding furnace prone to plate bending and plate warping, we all know, so how to prevent PCB board backwelding furnace plate bending and plate warping.
PCBA OEM has three main functions: 1. Assembly chip, 2. Processing, 3. test
How to improve customer satisfaction of PCBA assembly plant: first, PCBA assembly plant positioning, second, PCBA assembly plant operation, third, quality control of PCBA assembly plant
Compared with the circuit material without microsphere packing, the RO4730G3 circuit material with hollow microsphere packing may form metallized pores on the surface of rough pore wall.
The test circuits are based on a microstrip transmission line structure with a through-hole in the middle of the circuit used as a conductor and signal transition from the top copper layer of the dielectric substrate material to the bottom copper layer.
Printed circuit board A flat plate made of non-conductive material, usually with pre-drilled holes designed to hold chips and other electronic components. The holes of the components help to connect the pre-defined metal paths printed on the surface of th
