Контрактное производство электроники под ключ в Китае
FPGA BGA assembly patch manufacturer
Name: FPGA PCB assembly patch manufacturer
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Medical BGA motherboard assembly
Name: Medical BGA Motherboard
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
BGA industrial control motherboard assembly
Name: BGA industrial control motherboard assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 30 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Communication module BGA assembly
Name: Communication module BGA assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 20 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Consumer Electronics BGA assembly
Name: Consumer Electronics BGA assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 20 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Industrial control board BGA assembly
Name: Industrial control board BGA assembly
Number of SMT lines: 7 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 20 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, and the pin spacing can reach ±0.04mm
IC type patch accuracy: it has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Huawei 4G communication module BGA assembly
Name: Huawei 4G communication module BGA assemblyed
Number of SMT lines: 5 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
Amlogic Solution Multimedia Motherboard BGA assembly
Name: Amlogic Solution Multimedia Motherboard BGA assembly
Number of SMT lines: 5 high-speed SMT patch supporting production lines
SMT daily production capacity: more than 15 million points
Testing Equipment: X-RAY Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station
Placement speed: CHIP component placement speed (at best conditions) 0.036 S/piece
The smallest package that can be attached: 0201, the accuracy can reach ±0.04mm
Minimum device accuracy: PLCC, QFP, BGA, CSP and other devices can be mounted, with a pin pitch of ±0.04mm
IC type patch accuracy: It has a high level for mounting ultra-thin PCB boards, flexible PCB boards, gold fingers, etc. Can be mounted/inserted/mixed TFT display driver board, mobile phone motherboard, battery protection circuit and other difficult products
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- PCB Assembly Capability
- PCB Assembly Equipment
| SMT capacity: 19 million points/day | ||
| Testing Equipment | X-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework Station | |
| Placement speed | Chip placement speed (at best conditions) 0.036 S/piece | |
| Mounted Component Specifications | Pasteable smallest package | |
| Minimum device accuracy | ||
| IC type chip accuracy | ||
| Mounted PCB Specifications | Substrate size | |
| Substrate thickness | ||
| throw rate | 1. Resistance-capacitance ratio 0.3% | |
| 2. IC type without throwing material | ||
| Board Type | POP/common board/FPC/rigid-flex board/metal substrate | |
| DIP daily production capacity | ||
| DIP plug-in production line | 50000 points/day | |
| DIP post welding production line | 20000 points/day | |
| DIP test production line | 50000pcs PCBA/day | |
| Assembly processing capability | ||
| The company has more than 10 advanced assembly production lines, dust-free and anti-static air-conditioning workshop, TP dust-free workshop, equipped with aging room, test room, functional test isolation room, advanced and perfect equipment, can carry out various product assembly, packaging, testing, Aging, etc. production. Monthly production capacity can reach 150,000 to 300,000 sets/month | ||
| PCBA processing capability | ||
| project | Mass processing capability | Small batch processing capability |
| Number of layers (max) | 2-18 | 20-30 |
| Plate type | FR-4, Ceramic Sheet, Aluminum Base Sheet PTFE, Halogen Free Sheet, High Tg Sheet | PTFE, PPO, PPE |
| Rogers,etc Teflon | E-65, ect | |
| Sheet mixing | 4 layers - 6 layers | 6th floor - 8th floor |
| biggest size | 610mm X 1100mm | / |
| Dimensional Accuracy | ±0.13mm | ±0.10mm |
| Plate thickness range | 0.2mm--6.00mm | 0.2mm--8.00mm |
| Thickness tolerance ( t≥0.8mm) | ±8% | ±5% |
| Thickness tolerance (t＜0.8mm) | ±10% | ±8% |
| Media thickness | 0.076mm--6.00mm | 0.076mm--0.100mm |
| Minimum line width | 0.10mm | 0.075mm |
| Minimum spacing | 0.10mm | 0.075mm |
| Outer copper thickness | 8.75um--175um | 8.75um--280um |
| Inner layer copper thickness | 17.5um--175um | 0.15mm--0.25mm |
| Drilling hole diameter (mechanical drill) | 0.25mm--6.00mm | 0.15mm--0.25mm |
| Hole diameter (mechanical drill) | 0.20mm--6.00mm | 0.10mm--0.20mm |
| Hole Tolerance (Mechanical Drill) | 0.05mm | / |
| Hole tolerance (mechanical drill) | 0.075mm | 0.050mm |
| Laser Drilling Aperture | 0.10mm | 0.075mm |
| Plate thickness aperture ratio | 10：1 | 12：1 |
| Solder mask type | Photosensitive green, yellow, black, purple, blue, ink | / |
| Minimum Solder Mask Bridge Width | 0.10mm | 0.075mm |
| Minimum Solder Mask Isolation Ring | 0.05mm | 0.025mm |
| Plug hole diameter | 0.25mm--0.60mm | 0.60mm-0.80mm |
| Impedance tolerance | ±10% | ±5% |
| Surface treatment type | Hot air leveling, chemical nickel gold, immersion silver, electroplated nickel gold, chemical immersion tin, gold finger card board | Immersion Tin, OSP |
Automatic solder paste printing machine
AOI Optical Inspection
SMT high-speed placement machine
Nitrogen reflow soldering
x-ray
Three anti-paint spraying machine
SPI Solder Paste Thickness Tester
Automatic wave soldering machine
first article inspection
Our complete turnkey PCB assembly service provides a 24 hour quote service for your turnkey PCB assembly order.
Kingford cooperates with world-renowned component suppliers to ensure that the source of electronic components is plastic and the authenticity is guaranteed.
It has 7 fully automatic SMT high-speed chip production lines, equipped with ten temperature zone nitrogen reflow ovens, online AOI, SPI, X-RAY and other equipment.
We have complete ISO9001, ISO13485, ISO14001, IATF 16949, UL and other system certifications, and our products meet environmental protection requirements.
KingFord is a manufacturer specializing in the production of FPGA BGA assembly patch manufacturer. W...
kingford provides high-precision Medical BGA motherboard assembly and supporting testing systems. W...
We supply Camera module BGA assembly, using dual-channel memory architecture and AMD A68H FCH (Bolto...
The Communication module BGA assembly solution completed by Kingford has reached the best in terms o...
The Consumer Electronics BGA assembly processed and produced by Kingford uses high-quality chips and...
The Industrial control board BGA assemblyed by Kingford is of high quality, and each process in the ...
Yes! You can rely on our BGA rework services to ensure optimum performance.
Our BGA printed circuit board capabilities cover the following: Micro Ball Grid Array (µBGA), Thin Chip Array Ball Grid Array (CTBGA), Chip Array Ball Grid Array (CABGA), Ultra Thin Chip Array Ball Grid Array (CVBGA), Fine Pitch Ball Grid Array (VFBGA), Land Grid Array (LGA), Chip Scale Package (CSP), Wafer Level Chip Scale Package (WLCSP)
BGA or Ball Grid Array is a high density PCB packaging technology widely used in integrated circuits and is a popular surface mount package due to the precision component placement it provides.