Virtual welding is a very common line fault, one is in the process of circuit board production, caused by improper production technology, when the unstable state; The other is that after long-term use of electrical appliances, some of the more serious hea
Reasons for the change in the size of the substrate in the process of circuit board production: (1) the difference in the direction of longitude and latitude caused by the size changes of the substrate, the substrate surface copper foil is etched off the
PCB circuit opening and short circuit are problems encountered by PCB manufacturers almost every day, so pcb manufacturers should pay attention to production and avoid short circuit problems
PCBA manufacturers take you to solve the SMT patch processing tablet problem: In SMT patch processing, sometimes there will be the phenomenon of stellerization. The root cause of stellerization is that the welding tension on both sides of the component is
How do we judge the quality of PCB board: 1. Distinguish the quality of PCB board by its appearance; 2. From the PCB board itself to judge its quality, 3. How to judge the SMT patch processing quality: 1. A complete, smooth, polished surface; 2. The appro
In the choice of PCBA patch processing manufacturers, electronics factories are very careful, so we should choose from the following points: first, customer experience, second, production qualifications, three, cost, four, service
There are six points to evaluate the manufacturability of PCB design:1. DFM review of light board2. Check the consistency between the actual components and the pad3. Generate 3D graphics: heat, whether it is conducive to SMT reflow welding heat absorption
Solder joint stripping sometimes occurs in through-hole wave soldering. This phenomenon is caused by the failure between the solder joint and the welding pad. The main reason for this phenomenon is that the thermal expansion coefficient between the lead-f
In SMT processing, it is often necessary to replace chip components. When replacing chip components, it is necessary to pay attention to that the amount of solder should not be too much, otherwise the melted solder will flow under the component and cause
With the product is thin and short, the application of FPC is more and more, some of them replace the traditional PCB, as the electronic products become smaller and smaller, the connector of FPC is also getting smaller and smaller, although the FPC does n
Flexible circuit board has the characteristics of short, small, light and thin; It has the characteristics of high assembly density and small volume. There are high cost, long cycle, complex inspection methods, etc., which is a process that all FPC circui
The technical realization process of PCB copying board is simple. Firstly, the circuit board of the copying board shall be scanned, the location of components shall be recorded, the components shall be removed and made into material list, and the material
