Контрактное производство электроники под ключ в Китае
- PCB Design Capabilities
PCB Design&Layout Capabilities | |||
Min.trace width: | 2.5mil | Min.trace spacing | 2.5mil |
Min.Vias: | 6mil(4mil laser drilling) | Max.layer | 48L |
Min.BGA spacing | 0.35mm | Max.BGA Pin | 3600pin |
Max.high-speed signal | 40 GBPS | Fastest delivery time | 6 Hours/ Item |
HDI Highest layer | 22 L | HDI Highest layer | 14 L any layer HDI |
PCB Design&Layout lead time | |||
Number of pins on the board | 0-1000 | Design lead time (working days) | 3-5 days |
2000-3000 | 5-8 days | ||
4000-5000 | 8-12 days | ||
6000-7000 | 12-15 days | ||
8000-9000 | 15-18 days | ||
10000-12000 | 18-20 days | ||
13000-15000 | 20-22 days | ||
16000-18000 | 22-25 days | ||
18000-20000 | 25-30 days | ||
Ultimate delivery capacity | 10000Pin/7 days | ||
PS: The above delivery date is the regular delivery date, and the accurate design delivery date needs to be comprehensively evaluated according to the number of components, difficulty, layers and other factors of the circuit board! |
Kingford
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Kingford
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Kingford
Goldfinger PCB Design FAQ
Excellent electrical conductivity due to direct board connection and more gold thickness, strong wear resistance allows the PCB to be plugged and unplugged thousands of times, and the PCB pads use a hard gold plating process with good oxidation resistance.
Raised corners, nicks, scratches, sink (spots) and tin stains, oxidation, exposed copper or exposed nickel, spot copper shavings, test pin spots.
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