Контрактное производство электроники под ключ в Китае
Связанные технологии

Связанные технологии

PCB manufacturing capability

Standard PCB Production CapabilityFeatureCapabilityQuality GradeStandard IPC 2Number of Layers1 - 32layersOrder Quantity1pc - 10,000,000 pcsBuild Time2days - 5weeks (Expedited Service)MaterialFR-4 Standard Tg 150°C, FR4-High Tg 170°C, FR4-High-Tg 180°C, F

Multilayer PCB Capability

Multilayer PCB Production CapabilityItemCapabilityLayer Count1-40layersBase MaterialKB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/T

FPC Fabrication Capability

ItemUsualUnusualPCB Layers1 – 12 layersLaminate | MaterialFlexible part: DuPont PI, Shengyi PIRigid part: PI/FR4FR4, for lead-free weldinglow-loss materialHalogen freeSpecial materials: Rogers/Arlon/Nelco/Taconic etcPTFEPolyimideDelivery SizeDelivery Size

HDI PCB Capability

HDI (High Density Interconnect) PCB Process CapabilityItembatchTemplatelayers4-16 Layers4-24 LayersPlate thickness range0.6-3.2mm0.4-6.0mmhighest order4+N+4Any layer innterconnectedMinimum laser hole4mil (0.1mm)3mil (0.075mm)Laser processCO2 Laser Machine

PCB Capability

ItemCapabilityLayer Count1-40layersBase MaterialKB、Shengyi、ShengyiSF305、FR408、FR408HR、IS410、FR406、GETEK、370HR、IT180A、Rogers4350B、Rogers4000、PTFE Laminates(Rogers series、Taconic series、Arlon series、Nelco series)、Rogers/Taconic/Arlon/Nelco laminate with FR-

Thick Copper PCB Capability

Thick Copper PCB CapabilityFeatureCapabilityMaterialFR-4 Standard Tg 140°C, FR4-High Tg 170°CMin. Track/SpacingFor External layers:4oz Cu 10mil/13mil,5oz Cu 12mil/15mil6oz Cu 15mil/15milFor Internal layers:4oz Cu 8mil/8mil,5oz Cu 10mil/10mil6oz Cu 12mil/1

PCB Prototype Capabilities

PCB Prototype FeaturesCapabilityQuality GradeStandard IPC 1-3Number of Layers1 – 32layersOrder Quantity1pcs +Build Time2 – 15 daysMaterialRigid: FR2, CEM-1, CEM-3, FR4 (standard – halogen-free – high performance) including ShengYi, Iteq, Elite Materials C

PCB Assembly Capability

ItemProcess Capability ParameterOrder Quantity≥1PCQuality GradeIPC-A-610Lead Time24 hours expedited service can be offered. 3- 4 days normally for PCBA prototype orders. We will give you an accurate lead time when we quote for you.Size50*50mm~510*460mmBoa

PCB Fabrication Capability

ItemManufacturing CapabilityPCB Layers1~64 LayerQuality GradeIPC Class 2|IPC Class 3Laminate/Base materialFR-4|S1141|High Tg|PTFE|Ceramic PCB|Polyimide|S1000-2|IT180A|Isola-FR408HR|FR406|Isola 370 HR|Rogers|Taconic|Arlon|Halogen Free, etc.Brand of Laminat

PCB Assembly Capability

SMT capacity: 19 million points/dayTesting EquipmentX-RAY Nondestructive Tester, First Piece Tester, AOI Automatic Optical Tester, ICT Tester, BGA Rework StationPlacement speedChip placement speed (at best conditions) 0.036 S/pieceMounted Component Specif

Aluminum PCB Capability

Aluminum PCB CapabilityAluminum PCB FeatureParameter (in)Parameter (mm)Layers1 – 61 – 6Max Board Size24” x 40”609.6 x 1016mmMin Board Thickness – 1-2 (layers)16mil0.4mmMin Board Thickness – 4 (layers)20mil0.5mmMin Board Thickness – 6 (layers)24mil0.6mmBoa

PCB manufacturing equipment

PCB Drilling machinePCB pattern plating linePCB solder mask expose machinePCB pattern expose machineStrip film etching lineSolder mask screen silk print machineSolder mask scrubbing linePCB Flying Probe Test (FPT)Fully automatic exposure machine

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